Ausgabe 09/00
Editorial Part Electroplating
Articles Measurement and Correction of Macro-stress in Electrodeposits (Heiner, R.; Heuberger, U.; Pfund, A.; Zielonka, A.) New Cyanide- and sulphite-free Gold Deposition Processes (Simon F.; Kuhn, W.) A fundamentally new mechanism for additive metallization of polymeric substrates in ultra fine line technology illustrated for 3D-MIDs (Naundorf G.; Wissbrock, H.) (Größe: 465 KB)Direct Current Supply in a Modern Plating Plant (Munk, F.) Use of Organic Additives in Electrogalvanising of Sheet and Tube with Zinc and its Alloys (Hülser, P.) Improved Cost-Effectiveness of Decorative Plating Plants by Reducing or Eliminating Effluent Discharge (Pies, P.)
Reports
Coating Technology
Articles Powder Coatings, Pre-Treatment and Quality Control of Aluminum for Architectural Applications (Pietschmann, J.; Jehn, H.) (Größe: 192 KB)
Editorial Part Thin Film and Plasma Technique
Articles Spray Forming Composite Combustion Chamber Structures (Vlcek, J. et.al.)
Editorial Part Microengineering
Articles The Microfactory System Using Electrochemical Machining (Suda, M., Furata, K.; Sakuhara, T.; Akata, T.) (Größe: 846 KB)High-Strength Nanocrystalline Nickel-Tungsten Alloys Produced by Electrodeposition (Yamasaki, T.) (Größe: 112 KB)
Environmental Technology
