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Ausgabe 03/2004
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Latest News / Exhibitions
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Design
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Construction and Layout Guidance for Use of Zero-Power Connectors to Flexible and Rigid Printed Circuit Boards
(R. Münzberg)
The CIM Team Complete the E3.series as a SAP Interface for ALD Fabricators
Software for Power Supplies to Printed Circuit Boards
(G. Prillwitz)
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VTE
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Welcome to the New VTE, Now Part of PLUS
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DVS
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Development of Miniaturized Planar Fuel Cells Using Thin-Film and Micro-Patterning Technologies
(St. Wagner, R. Hahn, T. Fischer, F. Ebling, H. Reichl, M. Krumm, K. Marquardt)
Low-Voltage Actuation of RF-MEMS Switch Using Piezoelectric PZT Thin-Films
(I. Kanno, H. Endo, H. Kotera)
RF MEMS Glass Frit Packaging
(M. Reimann, M. Ulm, Th. Buck, J. Schöbel, J. Dechow, R. Müller-Fiedler)
Microsystem Technology in New Application Areas
(E. Jung)
Model Electronic Assemblies for Lead-Free Solder Trials
Trends and Opportunities in Electronic Assemblies
Status and Development Trends in Micro-System Technology. Requirements for Assembly and Interconnection Technologies
(R. Schließer)
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Printed Circuit Board Technologies
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FPC - known how
Product News
Flexible Printed Circuit Boards – Multiple Options for Packaging of Innovative Products
(H. Kober)
HMS: Compact Plater as an Answer to HDI and Flex
Straight to the Point
(H.J. Friedrichkeit)
µ-Flex Substrates: New Developments in Production of Highest Definition Tracks
(J. Günther)
AT&S See Asia as their Main Market
Upturn and a Price War
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Packaging / Hybrid Technology
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Fine Pitch Wire Bonding – Status and Development Trends
(L. Mattheier, F. Rudolf)
Product News
AiF Joint Project 2004-2006
Mechanical Test Methods for Micro-connections in Highly Miniaturised Electronic Circuits
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Board Assembly Technologies
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Product News
Secondary Reflow - Another Lead-Free Defect
(B. Willis)
Optimising Reflow Temperature Profiles with ReflowCoach
Siemens Dematic to be Integrated into the Siemens Business Structure
Retro-Fit Flux Condenser for Reflow Plants
Reliable and Precise Solder Screen-Printing Inspection in Cycle-Time of Line
Germany Awaits a 10 % Growth in Semiconductors
Innovative Technologies and Processes – Part II
(F. Albert, M. Boiger, P.-F. Brenner, I. Mys)
Lead-free Processable IC’s
(F.-W. Wulfert)
ZAVT Forum: Components for Use with Lead-Free Solders
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Forum
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IPC is Visibly Globalising – And Not Just on Lead-Free
Chinese Electronics Exports Strongly Affected by New EU WEEE and RoHS Regulations
2nd Competence Meeting: Micro-System Technology and Microelectronics in the Automotive Industry
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Association News
(All Association News are only in German)
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3-D MID-Informationen 
DVS-Mitteilungen
FED-Informationen
VdL-Nachrichten
ZVEI-Mitteilungen
IMAPS-Mitteilungen |
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