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Ausgabe 04/2002
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Design
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Plastics in electronics – more than ever a field for specialists and a permanent challenge for design and manufacturing
IPC-251B production data description (GenCAM) completed with XML
Innoveda presents PowerPCB 5.0 with high speed routing functions
Ansoft TPA 4.0 speeds up time to market of complex flip chip packages
Fit for the data formate of the future
Product News
CAD-CAM information transfer in PCB industry
(A. Wiemers, B. Nissen)
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Printed Circuit Board Technologies
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B&B with new strategy
Automatic optical inspection is part of the standard
HTC extends service portfolio
Flying Prober still faster
atg cuts test time by half
Live cycles of products in focus
Recycling technology at VOGT electronics FUBA GmbH
micro³s: a new service center in Mecklenburg
Hofstetter offers more than just the reduction of output peaks
First experiment successful – DVS/GMM meeting
Electronic assemblies – build-up and manufacturing technology
LUDY Systemtechnik goes global
Plus Focus Internet
Rapid Prototyping of PCB (part 2)
The flying prober offenive MicroCraft is focusing on Europe
DODUSTANTM electroless tin – new perspectives for the PCB technology
New from Shipley: Circubond 2200 – innovation for inner layer bonding
Product News
Three in one go
Fischer presents universal instrument for PCB thickness measurement
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Packaging / Hybrid Technology
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Market situation of integrated thick film circuits
(E. Effenberger)
New manfucturing system for high-grade silver powder at AMI DODUCO
Datacon goes global
Product News
Wafer Scale Package for logic components
(B. Lange)
Product News
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Board Assembly Technologies
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Representatives from Japan, Europe and USA discuss possibility of world-wide lead-free technology roadmap
Pin in paste enables reflow soldering of leaded components
(J. Jess)
New QRS version available from Router Solutions
This years SMT/Hybrid/Packaging Show pinpoints opto electronics and micro sytems
Image processing for laser systems from LS Laser Systems
SMD Inserter with small footprint
Balver Zinn: lead free solder tin according to Japanese standard
Scorpion test solutions are high flyers
First experiment successful – DVS/GMM meeting
Electronic assemblies – build-up and manufacturing technology
BFE: it’s time to move into lead-free technology now
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Forum
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Research project PROGRESS: reduction of development time in the electronic industry
Some book reviews by Bob Willis
OLED technology penetrates the market for conductive poylmeres
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Association News
(All Association News are only in German)
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