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Ausgabe 04/2004
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Latest News / Exhibitions
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Design
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Current-Carrying Capacity of Printed Circuit Board Tracks. Part 3. Further Diagrams for Multilayers and Conversion Calculation Rules
(J. Adam)
OTTI Professionals Forum for Innovative Printed Circuit Board Design Offered a Good Overview
Altium’s LiveDesign Software Brings New Approach to Design & Development of Electronic Systems
Lead-free Electronics: Differing Views of the EU Commission/ZVEI and IPC on Limiting Values
(H. Poschmann)
Product News
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VTE
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Lead-Free Through the Back Door?
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DVS
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FLIP Drastically Reduces Use of Lead-Free Solder in Wave-Soldering
Study of Boundary Areas in Ultrasonic Wedge-Wedge Bonding of 25-µm AlSi1 Wire
Bonding and Disbonding of Aluminium Wires Using Ultrasonic Wedge-Wedge Bonding
(M. Schneider-Ramelow, A. Ferber, K.-D. Lang)
Project Funded by the Industrial Research Foundation
Further Development of Test Procedures for Bonded and Soldered Joints in Assemblies and Modules in Power Electronics
Pooled Research into Lead-Free Solders
Market Survey: Who is Offering Plant and Equipment for Soldering in Electronics Manufacture?
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Printed Circuit Board Technologies
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German PCB Market: Book-to-Bill Ratio Moves Up
European Printed Circuit Board Industry Moving into Better Times EIPC Winter Conference in Cannes
Laminates for Lead-Free Electronics
Optimism and Good Prospects Hailed for US Electronics & Printed Circuit Board Industry
IPC Expo, APEX and Designer’s Summit
Product News
SEAG Moves into the Future with LUST, MUT and Innovative Concepts
Will India Follow in Footsteps of China’s Success Story ?
Straight to the Point
(H.J. Friedrichkeit)
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Packaging / Hybrid Technology
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Plastics in Electronics
A Multi-Functional Dispensing System for Packaging
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Board Assembly Technologies
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SMT Connectors from Zierick Allow Automated Continuous Production
When Does Repair and Reworking Pay off?
Quality is Top Priority at Christian Koenen
Successful Rutronik-Seminar „Lead-free Soldering“
Bonding Wires from 17 to 600 µm with Just One Machine
The New Bonder Series 64/66000 G5 from F & K Delvotec
AOI has Rapidly Become a “Must” at Hasec Elektronik
Product News
SMT/Packaging/Hybrid 2004
The Printed Circuit Board in Focus
Lead-free: There will be Some Thing in Store for us!
EMV 2004 Düsseldorf – Exhibition Facing Gloomy Prospects?
Product News
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Forum
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Some Tightening-up, but No All-Clear: The German Draft of WEEE and RoHS is Published
(H. Poschmann)
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Association News
(All Association News are only in German)
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3-D MID-Informationen 
DVS-Mitteilungen
FED-Informationen
VdL-Nachrichten
ZVEI-Mitteilungen
IMAPS-Mitteilungen |
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