|

Ausgabe 05/2002


|
 |
|
Design
|
 |
|
Altra Broadband moves on xDSM Transceiver Boards for Broadband Network
Biggest Event of the Year for Designers in the USA
The SMS boom rolls on – and should continue at least till 2005
First Results from the FED/VdL Questionnaire on PCB’s with defined impedance
Valor & Syncron Technologies move into automated generation of interconnection pads of components
DRC: Fundamental Design Rules for CAD, CAM and PCB’s
New FED Seminar for those working in CAD & CAM.
New design Tools from Ansoft
Plenty of Action at Innoveda: A Complete New Design System for High-Speed PCB’s and Change of Management
Mentor Graphics extends its product range for the cable harness industry
The FED/VdL Design Project Group – What is its Focus Now ?
|
|
|
|
Printed Circuit Board Technologies
|
 |
|
Traceability in the PCB Industry
ppe is promoted
“Made in China”-PCB’s: Ready for HDI Evolution
CPCA 2002 Show in Shanghai
LPKF beefs up for the Future
Consolidation of Substrate Materials for GHz Scale Use
PCB Group Projects in the Lower Rhine Area
VDI/VDE Committee on PCB production at Messrs Lackwerk Peters
Substrate for Microvia Drilled Layers in HDI PCB’s (J. Willuweit)
ERNI acquires license for Optical Backplanes from Daimler-Chrysler
PPS WDSOFT-WIN is ready for market launch
Reworking of PCB’s can pay off
Peripheral Systems for Today’s Technology – Ready for Tomorrow’s
Atotech introduces its peripheral Simatic ET 200S system into plating lines
|
|
|
Packaging / Hybrid Technology
|
 |
|
Bonding of PPS to Aluminium in Automotive Applications (St. Kienitz)
Assembly and Interconnection Technologies for High Density Integration – One for All?
German IMAPS Seminar 2002 at FHTE Göppingen
Flip-Chip & Chip-Scale Europe 2002 – More than a Glimmer of Hope
Micro-engineering and Sensor Professional Associations Get Together
After a record year in 2000, ESEC faces up to collapse in Turnover and Heavy Losses in 2001
|
|
|
|
Board Assembly Technologies
|
 |
|
Upcoming – Preview of SMT/Hybrid/Packaging 2002
Kwikboard – A Fast Path to Prototypes
No Small Anniversary - 5th European Electronics technology Colloquium
Traceability in Board Assembly Industry
MES intraFACTORY
In-Line Vacuum Vapour Phase Solder Plants – Are they Essential?
4th International ESD Workshop 2002 in Dresden
Automated and selective conformal coating of populated PCB’s without additional Masking stages (G. Schulze)
ESSEMTEC launches SMD Competence Centre for Short/Medium Runs
|
|
|
Forum
|
 |
|
JUMO: 2001 Better than Previous Year
Exporting to New Markets: www alone is not enough (E. Effenberger)
A Premiere in Shanghai: electronicChina
EMV 2002 – Trade Show and Congress for Electromagnetic Compatibility
Tecnomatix eMPower 6.0 – Increased Power for Production Planners
|
|
Association News (All Association News are only in German)
|
 |
|
3-D MID-Informationen
DVS-Mitteilungen 
FED-Informationen 
VdL-Nachrichten 
ZVEI-Mitteilungen
IMAPS-Mitteilungen  |
|