|
Ausgabe 12/2001
|
 |
|
Design
|
|
|
FED/VdL Project Group extended by Board Assemblier
New tool for component placement on PCB
(B.Stube, B. Schröder, W. Schade)
Integration of Simulation Tools in modern EDA Software Supporting EMI and High-Speed Design (Part 1)
HOSCHAR AG opened Business Center at Karlsruhe Technologiepark
Board Assembly Documentation as seen by the manufacturer and designer
Meeting of the FED Regional group Düsseldorf at MSC Vertriebs GmbH
Mentor Graphics updates Verification and Analysis Tool for faster PCB Design
Product News
(A. Marquordt)
|
|
|
|
|
Printed Circuit Board Technologies
|
|
|
Product News
Leitec GmbH: 10 years of full service for PCB
Chip-in-Polymer – an additional challenge
International congress at Waiblingen
EIPC with new management and extended activities
MacDermid Equipment´s new system generation for resist development
GS Günther Strecker Gestelltechnik celebrates its 30th anniversary
Creating the future by orientation
Specialist meeting of VdL/ZVEI
Productronica 2001: better than expected
Preliminary reports
Thermal management of power electronics on PCB
Well prepared for the upturn
Official opening of the new extension of the Inboard plant
PCB Electrical Test Flying Probe Benchmarking Report 2001
(H. Pietruschka)
Design, Manufacture and Reliability of HDI-PCBs in SSBU Technology
9th workshop µTP at Multek Boeblingen
Members congregation of VdL (Verband der Leiterplattenindustrie im ZVEI)
|
|
|
|
Packaging / Hybrid Technology
|
|
|
Product News
EITI visiting Würth Solar Technology
LTCC multilayer ceramics for radio- and sensor applications
(R. Kulke, M. Rittweger, P. Uhlig, C. Günner)
The impact fo stacked Chip-Scale Packages on future mobile applications
(L. Smith)
zum schnellen Leiterplatten-Design
|
|
|
|
|
Board Assembly Technologies
|
|
|
Productronica 2001: tops and flops close together, but optimism under the line
Preliminary reports
Teradyne and GenRad first time jointly at Productronica 2001
NanoFocus launches new 3D µScan precision inspection system
25 years in the field – Reinhardt Test Systems
Elimination of solder beading –
first you need to consider what causes solder beads
(B. Willis)
Real time statistical process control for PCB assembly
(S. Davis)
Profile: Technical High School Aschaffenburg has better offers: new courses, specific services and a particular ‘ambiente’
Product News
|
|
|
|
Forum
|
|
|
The new ISO 9000:2000 – What is changing in quality assurance?
(G. Keller)
The training in the new specialist job ‘Micro technologist’ improves in shape
|
|
|
Association News
(All Association News are only in German)
|
|
|
|
3-D MID-Informationen 
DVS-Mitteilungen
FED-Informationen
VdL-Nachrichten
ZVEI-Mitteilungen
IMAPS-Mitteilungen |
|
